Title:
基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法
Document Type and Number:
Japanese Patent JP5810914
Kind Code:
B2
Abstract:
In order to integrate substrate holders respectively holding semiconductor substrates such that the semiconductor substrates are sandwiched in a layered state, a fixing mechanism is needed to fix the substrate holders to each other. The contact points in the fixing mechanism can generate dust. Therefore, provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate; an engagement receiving member provided on the second substrate holder at a position facing the engaging member when the first substrate holder and the second substrate holder face each other and sandwich the first substrate and the second substrate; and a buffer portion provided on at least one of a contact portion of the engaging member and a contact portion of the engagement receiving member.
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Inventors:
Isao Sugaya
Junnan
Maeda Eihiro
Junnan
Maeda Eihiro
Application Number:
JP2011523552A
Publication Date:
November 11, 2015
Filing Date:
July 21, 2010
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| JP2007005335A | 2007-01-11 | |||
| JP2005260275A | 2005-09-22 | |||
| JP2008087847A | 2008-04-17 | |||
| JPH0853186A | 1996-02-27 | |||
| JP2007005335A | 2007-01-11 | |||
| JP2005260275A | 2005-09-22 | |||
| JP2003315759A | 2003-11-06 | |||
| JP2005251972A | 2005-09-15 | |||
| JP2005339706A | 2005-12-08 |
Foreign References:
| WO2009057710A1 | 2009-05-07 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation