Title:
半導体装置、および、半導体装置の実装構造
Document Type and Number:
Japanese Patent JP5813963
Kind Code:
B2
Abstract:
A semiconductor device includes a plurality of functional element chips, an electric connection member joined to two of the functional element chips, a first wire and a resin configured to cover the functional element chips, the electric connection member and the first wire. One of the two functional element chips may be a first semiconductor chip having first and second major surface electrodes facing toward the same direction and a first rear surface electrode facing in a direction opposite to a direction in which the first major surface electrode faces. The electric connection member may be joined to the first major surface electrode. The first wire may be joined to the second major surface electrode. The first wire may include a portion overlapping with the electric connection member in a thickness direction of the first semiconductor chip.
Inventors:
Yasufumi Matsuoka
Application Number:
JP2011041453A
Publication Date:
November 17, 2015
Filing Date:
February 28, 2011
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2006049542A | ||||
| JP2008300627A | ||||
| JP2009224560A | ||||
| JP2008182074A | ||||
| JP2004193476A | ||||
| JP2006156748A | ||||
| JP2008270844A |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tsukasa Senba
Yasumitsu Suzuki
Nao Usui
Tatsuya Tanaka
Tsukasa Senba
Yasumitsu Suzuki
Nao Usui