Title:
加圧ユニットを備えるウエハービアはんだ注入装置およびこれを用いたウエハービアはんだ注入方法
Document Type and Number:
Japanese Patent JP5826928
Kind Code:
B2
Abstract:
A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
Inventors:
Yuh, Sehun
Lee, Chang Woo
Kim, junki
Kim, john han
Ko, Yonki
Lee, Chang Woo
Kim, junki
Kim, john han
Ko, Yonki
Application Number:
JP2014520119A
Publication Date:
December 02, 2015
Filing Date:
July 10, 2012
Export Citation:
Assignee:
Korea Institute of Industrial Technology
International Classes:
B23K1/00; B23K1/08; B23K3/00
Domestic Patent References:
| JP9162537A | ||||
| JP2003133410A | ||||
| JP2010232603A | ||||
| JP2006082107A |
Attorney, Agent or Firm:
Tetsuya Mori
Hide Tanaka Tetsu
Ichi Hirose
Yuki Yamada
Hide Tanaka Tetsu
Ichi Hirose
Yuki Yamada