Title:
パワー半導体システム
Document Type and Number:
Japanese Patent JP5827873
Kind Code:
B2
Abstract:
The system (100) has a wall element (20) provided with an outer side and an inner side, and a power semiconductor circuitry (30) arranged at the outer side. The inner side of the wall element forms a liquid or gas-tight wall of a line system (10). A metal mold body (40) includes a recess that is directly arranged adjacent to the wall element. A capacitor is cooled by the metal mold body, formed as an uncased capacitor. The capacitor is arranged in the recess by a spacer and a capping unit. The wall element is formed as a metallic heat sink.
Inventors:
Peter Beckedar
Hartmut Coeur
Frank Eversberger
Hartmut Coeur
Frank Eversberger
Application Number:
JP2011241045A
Publication Date:
December 02, 2015
Filing Date:
November 02, 2011
Export Citation:
Assignee:
SEMIKRON Elektronik GmbH & Co.KG
International Classes:
H01L23/473; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP2010010505A | ||||
| JP2004523127A | ||||
| JP2005197562A | ||||
| JP2008029117A |
Foreign References:
| US20090219694 |
Attorney, Agent or Firm:
Fujita Akira
Hideki Imai
Hideki Imai