Title:
ウェハレベルの光学素子の取り付け
Document Type and Number:
Japanese Patent JP5829025
Kind Code:
B2
Abstract:
A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.
Inventors:
Shin, Harp Neat
Carpio, Illumina
You, Guan Hock
Carpio, Illumina
You, Guan Hock
Application Number:
JP2010547748A
Publication Date:
December 09, 2015
Filing Date:
February 19, 2009
Export Citation:
Assignee:
Nanchang O-Film Optoelectronics Technology Ltd
International Classes:
H04N5/225; G03B17/02; H01L27/14; H04N5/369
Domestic Patent References:
| JP9284617A | ||||
| JP200480774A | ||||
| JP2004207461A | ||||
| JP200210123A | ||||
| JP4027962B1 | ||||
| JP2005539276A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda
Hironobu Onda
Atsushi Honda