Title:
部材連結構造及びその部材連結構造を含む電子機器
Document Type and Number:
Japanese Patent JP5834296
Kind Code:
B2
Inventors:
Nakamura Eri
Application Number:
JP2013077224A
Publication Date:
December 16, 2015
Filing Date:
March 13, 2013
Export Citation:
Assignee:
M-System Co., Ltd.
International Classes:
F16B5/07; F16B21/02; H05K5/02
Domestic Patent References:
| JP2006120536A | ||||
| JP55117613U | ||||
| JP2003226200A | ||||
| JP4094279U | ||||
| JP6068934A |