Title:
光デバイスウエーハの加工方法
Document Type and Number:
Japanese Patent JP5840875
Kind Code:
B2
Inventors:
Aikawa Riki
Tomohiro Endo
Hitoshi Hoshino
Tomohiro Endo
Hitoshi Hoshino
Application Number:
JP2011137759A
Publication Date:
January 06, 2016
Filing Date:
June 21, 2011
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP2010016116A | ||||
| JP2004055684A | ||||
| JP2005246450A | ||||
| JP2009184002A | ||||
| JP2005116844A | ||||
| JP2007048995A | ||||
| JP2003258304A |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki