Title:
フレーク状銀粉及び導電性ペースト
Document Type and Number:
Japanese Patent JP5847516
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide flaky silver powder which can form a conductive film having excellent conductivity, to provide a method for producing the flaky silver powder, and to provide conductive paste.SOLUTION: The flaky silver powder satisfies the following formula (1): A×A×B>50, wherein A denotes the average particle diameter (unit: μm) by a laser diffraction scattering type particle size distribution measurement method of the flaky silver powder, and B denotes the BET specific surface area (unit: m/g) of the flaky silver powder. In the method for producing flaky silver powder, silver powder with the average particle diameter of 1-15 μm is extended with a solvent and balls that have a diameter of 0.1-3 mm, and is subjected to flaking treatment till the average particle diameter of the silver powder reaches the maximum or passes through the maximum value.
Inventors:
M. Mogi
Ken Inoue
Ken Inoue
Application Number:
JP2011212033A
Publication Date:
January 20, 2016
Filing Date:
September 28, 2011
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F1/00; B22F9/04; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
| JP2007254845A | ||||
| JP2003055701A |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Yoshihiro Nagare
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