Title:
複数の発光素子を実装するための基板
Document Type and Number:
Japanese Patent JP5851017
Kind Code:
B2
Abstract:
The present invention relates to a substrate (1) comprising: a first segment (5a) provided with a first contact pad (22a) for connection of a first light emitting element (2a); and a second segment (5b) provided with a second contact pad (22b) for connection of a second light emitting element (2b), wherein the substrate is provided with at least one through-hole (6a-c) that extends from an edge (8,9) of the substrate to a point within the substrate, such that a relative movement, in a plane of the substrate, can be achieved between the first segment (5a) of the substrate and the second segment (5b) of the substrate by applying a mechanical force to the substrate. This makes very accurate alignment to a multiple cavity optical system possible without adjusting the optics, thereby enabling a more convenient and time efficient process in production.
Inventors:
Kuaimans fibe
Application Number:
JP2014500497A
Publication Date:
February 03, 2016
Filing Date:
March 12, 2012
Export Citation:
Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
H01L33/00; F21V19/00; H05K1/02; H05K1/18
Domestic Patent References:
| JP2010027252A | ||||
| JP2006162654A | ||||
| JP2008518410A |
Attorney, Agent or Firm:
Patent Services Corporation m&s Partners