Title:
圧電素子の電気的接続構造の製造方法
Document Type and Number:
Japanese Patent JP5875216
Kind Code:
B2
Abstract:
An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.
Inventors:
Kim Satoshi
Application Number:
JP2010110691A
Publication Date:
March 02, 2016
Filing Date:
May 12, 2010
Export Citation:
Assignee:
Nippon Jojo Co., Ltd.
International Classes:
H01L41/09; B23K26/00; G11B5/596; G11B5/60; G11B21/10; H01L41/187
Domestic Patent References:
| JP2002252538A | ||||
| JP9318650A | ||||
| JP200361371A | ||||
| JP201086649A |
Attorney, Agent or Firm:
Yuichi Sudo