Title:
スパッタリング装置、絶縁膜の形成方法
Document Type and Number:
Japanese Patent JP5891040
Kind Code:
B2
More Like This:
JPH06224040 | MAGNETORESISTIVE MATERIAL |
JP2948025 | SPUTTERING TARGET |
JP2021533275 | Physical Vapor Deposition (PVD) Chamber with Reduced Arc Discharge |
Inventors:
Teppei Hashimoto
Mitsutaka Hirose
Shunsuke Sasaki
Keiichiro Asakawa
Jimbo Taketo
Zou Hirotsuna
Mitsutaka Hirose
Shunsuke Sasaki
Keiichiro Asakawa
Jimbo Taketo
Zou Hirotsuna
Application Number:
JP2012006481A
Publication Date:
March 22, 2016
Filing Date:
January 16, 2012
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/34
Domestic Patent References:
JP5328995B2 | ||||
JP2156080A | ||||
JP5148644A |
Foreign References:
WO2011158828A1 |
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe
Hideki Abe