Title:
半導体装置の製造方法及び半導体製造装置
Document Type and Number:
Japanese Patent JP5925940
Kind Code:
B2
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Inventors:
Masanori Shindo
Application Number:
JP2015094906A
Publication Date:
May 25, 2016
Filing Date:
May 07, 2015
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/027; G03F7/20; H01L21/288; H01L21/60
Domestic Patent References:
| JP2001156093A | ||||
| JP2005005462A | ||||
| JP2008047579A | ||||
| JP9283396A | ||||
| JP2007048814A | ||||
| JP61004229A | ||||
| JP2009266899A | ||||
| JP10209143A | ||||
| JP2008130789A |
Foreign References:
| WO2009104748A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda
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