Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6299807
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in bonding accuracy of external terminals and which can simplify a soldering process at the time of manufacturing.SOLUTION: In a semiconductor device of an embodiment, a hole 5a is formed in a metal layer 5 composing a circuit pattern formed on an insulating substrate 4. By press fitting an external terminal 20 in the hole 5a, the external terminal 20 is connected to the metal layer 5. in a cross section in a direction orthogonal to the external terminal 20 at a contact part 5b of the external terminal 20 and the hole 5a, the external terminal 20 touches an inner periphery of the hole at 40% and over.
Inventors:
Shinji Tada
Eiji Mochizuki
Yoshinari Ikeda
Tatsuo Nishizawa
Eiji Mochizuki
Yoshinari Ikeda
Tatsuo Nishizawa
Application Number:
JP2016086027A
Publication Date:
March 28, 2018
Filing Date:
April 22, 2016
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/12; H01L23/28; H01L25/07; H01L25/18
Domestic Patent References:
| JP2009021345A | ||||
| JP2010027813A | ||||
| JP11003912A | ||||
| JP2009260132A | ||||
| JP2007027467A | ||||
| JP9283682A | ||||
| JP2009147314A | ||||
| JP5999749A |
Foreign References:
| US20130082387 |
Attorney, Agent or Firm:
Shigeru Matsui