Title:
有機半導体膜形成用組成物、並びに、有機半導体素子及びその製造方法
Document Type and Number:
Japanese Patent JP6301488
Kind Code:
B2
Abstract:
The composition for forming an organic semiconductor film of the present invention contains a specific organic semiconductor as a component A, a binder polymer as a component B, a solvent having a naphthalene structure as a component C, and a solvent having a lower SP value than that of the component C by 2.0 MPa1/2 or greater and a lower boiling point than that of the component C, as a component D.
Inventors:
Kensuke Masui
Toshihiro Kaya
Hongo Yuji
Yuta Shigenoi
Toshihiro Kaya
Hongo Yuji
Yuta Shigenoi
Application Number:
JP2016551937A
Publication Date:
March 28, 2018
Filing Date:
September 18, 2015
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01L51/30; H01L29/786; H01L51/05; H01L51/40
Domestic Patent References:
| JP2013533606A | ||||
| JP2012500500A |
Foreign References:
| WO2014136436A1 | ||||
| WO2014123214A1 | ||||
| WO2014123215A1 | ||||
| WO2014119713A1 | ||||
| WO2014061465A1 | ||||
| WO2014034392A1 | ||||
| WO2013029733A1 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office