Title:
電子部品収納用パッケージ、電子装置および電子部品収納用パッケージの製造方法
Document Type and Number:
Japanese Patent JP6313235
Kind Code:
B2
Inventors:
Yoshitomo Onizuka
Application Number:
JP2015010400A
Publication Date:
April 18, 2018
Filing Date:
January 22, 2015
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/04; H01L23/12; H05K3/46
Domestic Patent References:
| JP2005252079A | ||||
| JP2007048844A |
Foreign References:
| WO2014125973A1 |