Title:
接続素子、および実装用素子
Document Type and Number:
Japanese Patent JP6372465
Kind Code:
B2
Inventors:
矢▲崎▼ 浩和
Toshiyuki Nakaiso
Ueki travelogue
Kenichi Ishizuka
Toshiyuki Nakaiso
Ueki travelogue
Kenichi Ishizuka
Application Number:
JP2015200699A
Publication Date:
August 15, 2018
Filing Date:
October 09, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L25/00; H01F17/00; H01G4/228; H01G4/33; H01L21/60; H01L23/12; H05K1/18
Domestic Patent References:
| JP57154134U | ||||
| JP5047600A | ||||
| JP2009076719A |
Foreign References:
| US20060158863 |
Attorney, Agent or Firm:
Kaede International Patent Office