Title:
金属焼結接合体、およびダイ接合方法
Document Type and Number:
Japanese Patent JP6376299
Kind Code:
B2
Abstract:
Provided is a metal sintered bonding body having an excellent heat cycle resistance and heat dissipation performance. The metal sintered bonding body according to the present invention bonds a substrate and a die. At least the center part and a corner part of a rectangular region in which the metal sintered body faces the die has a low porosity region having a porosity lower than the average porosity of the rectangular region. The low porosity region is located in a strip-shaped region in which the center line is a diagonal of the rectangular region.
More Like This:
| JPS61156824 | SEMICONDUCTOR DEVICE |
Inventors:
Takemasa Satoshi
Minoru Ueshima
Minoru Ueshima
Application Number:
JP2017561430A
Publication Date:
August 22, 2018
Filing Date:
August 17, 2017
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
H01L21/52
Domestic Patent References:
| JP2008311371A | ||||
| JP2015216160A | ||||
| JP2014029897A |
Foreign References:
| WO2012004876A1 | ||||
| WO2014155619A1 |
Attorney, Agent or Firm:
Hideki