Title:
タングステン膜エッチング液組成物、これを用いた電子デバイスの製造方法および電子デバイス
Document Type and Number:
Japanese Patent JP6378271
Kind Code:
B2
Abstract:
The present disclosure relates to an etching solution composition for a tungsten layer including N-methylmorpholine N-oxide and water, which is effective in selectively etching only a tungsten-based metal without etching a titanium nitride-based metal or a titanium aluminum carbide layer.
Inventors:
Kim, Sung-Min
Cho, Yong-Joon
Lee, Kyung-ho
Cho, Yong-Joon
Lee, Kyung-ho
Application Number:
JP2016176546A
Publication Date:
August 22, 2018
Filing Date:
September 09, 2016
Export Citation:
Assignee:
DONGWOO FINE-CHEM CO., LTD.
International Classes:
H01L21/308; C23F1/38
Domestic Patent References:
| JP2010524208A | ||||
| JP2011233769A |
Foreign References:
| US20150104952 | ||||
| US20130303420 |
Attorney, Agent or Firm:
Atomi International Patent Office