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Title:
任意のイットリア被覆層を有するAlONコーティングされた基体
Document Type and Number:
Japanese Patent JP6404381
Kind Code:
B2
Abstract:
A fluorine plasma resistant coating on a substrate being a component in a semiconductor manufacturing system is disclosed. In one embodiment the composition includes an AlON coating that overlies a substrate, and an optional yttria coating layer that overlies the AlON coating, with a total coating thickness of about 5-6 microns.

Inventors:
Niresh Gunda
Application Number:
JP2017033144A
Publication Date:
October 10, 2018
Filing Date:
February 24, 2017
Export Citation:
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Assignee:
Entegris Incorporated
International Classes:
C23C14/06; C04B41/89
Domestic Patent References:
JP7153370A
JP2006157043A
JP2008080712A
JP2009287058A
JP2010280941A
JP2000164572A
JP11214194A
JP2007290933A
JP2011139047A
JP3281779A
JP1108187A
JP2006179860A
Foreign References:
WO2011066314A1
WO2008041402A1
WO2012018970A1
Other References:
M. Wolborski et al.,Improved Properties of AlON/4H-SiC Interface for Passivation Studies,MATERIALS SCIENCE FORUM,2009年 1月,Vol. 600-603,pp. 763-766
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation