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Title:
窒素含有環化合物を含むポリマーを含むレジスト下層膜形成組成物
Document Type and Number:
Japanese Patent JP6410053
Kind Code:
B2
Abstract:
The present invention provides a resist underlayer film that has a wide focus position range within which a good resist shape can be obtained. A resist underlayer film-forming composition for lithography comprising a linear polymer that is obtained by a reaction of a diepoxy group-containing compound (A) with a dicarboxyl group-containing compound (B). The linear polymer has structures of the following formulae (1), (2), and (3) derived from the diepoxy group-containing compound (A) or the dicarboxyl group-containing compound (B): The linear polymer preferably contains a polymer obtained by a reaction of two diepoxy group-containing compounds (A) each having structures of Formulae (1) and (2) with a dicarboxyl group-containing compound (B) having a structure of Formula (3), or a polymer obtained by a reaction of a diepoxy group-containing compound (A) having a structure of Formula (1) with two dicarboxyl group-containing compounds (B) each having structures of Formulae (2) and (3).

Inventors:
Onishi Ryuji
Ryuta Mizuochi
Nishida Tokio
Yasushi Sakaida
Rikimaru Sakamoto
Application Number:
JP2015530858A
Publication Date:
October 24, 2018
Filing Date:
August 01, 2014
Export Citation:
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Assignee:
Nissan Chemical Co., Ltd.
International Classes:
G03F7/11; C08G59/42; H01L21/027
Domestic Patent References:
JP2009093162A
JP2009175436A
Foreign References:
WO2009008446A1
WO2005098542A1
WO2006115074A1
WO2012169580A1
WO2009104685A1
WO2013018802A1
Attorney, Agent or Firm:
Hanabusa Patent and Trademark Office



 
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