Title:
ポリアミド−イミド前駆体、ポリアミド−イミドフィルム及びこれを含む表示素子
Document Type and Number:
Japanese Patent JP6410946
Kind Code:
B2
Abstract:
The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).
Inventors:
Yang, Jeong Won
Chung, Hakuki
Chung, Hakuki
Application Number:
JP2017534993A
Publication Date:
October 24, 2018
Filing Date:
December 31, 2015
Export Citation:
Assignee:
Kolon Industries Inc.
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| JP2014220348A | ||||
| JP2012241196A | ||||
| JP2014528490A |
Attorney, Agent or Firm:
Yamashita