Title:
ネットワークシステム
Document Type and Number:
Japanese Patent JP6415056
Kind Code:
B2
Inventors:
Lacquer field Naoki
Tanemura Hideki
Naoaki Ojiri
Shimokawa Chigusa
Tanemura Hideki
Naoaki Ojiri
Shimokawa Chigusa
Application Number:
JP2014018048A
Publication Date:
October 31, 2018
Filing Date:
January 31, 2014
Export Citation:
Assignee:
Biomimetics Sympathies, Inc.
International Classes:
G06Q50/22; A61K35/12
Domestic Patent References:
JP2004185192A |
Foreign References:
WO2006001397A1 |
Attorney, Agent or Firm:
Takahashi Patent Office
Previous Patent: 磁気軸受上の高速フライホイール
Next Patent: PREPARATION OF ANTITHROMBOGENIC MATERIAL BY GRAFT COPOLYMERIZATION
Next Patent: PREPARATION OF ANTITHROMBOGENIC MATERIAL BY GRAFT COPOLYMERIZATION