Title:
半導体部品および電子機器
Document Type and Number:
Japanese Patent JP6417700
Kind Code:
B2
Abstract:
A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.
More Like This:
| JPS57100754 | SEMICONDUCTOR CIRCUIT DEVICE |
Inventors:
Shinichiro Uekusa
Application Number:
JP2014089112A
Publication Date:
November 07, 2018
Filing Date:
April 23, 2014
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/34
Domestic Patent References:
| JP2005347487A | ||||
| JP2013140979A | ||||
| JP2003338581A | ||||
| JP2008537637A |
Foreign References:
| US20040035840 |
Attorney, Agent or Firm:
Akira Hirakawa
Daisuke Takada
Daisuke Takada