Title:
樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
Document Type and Number:
Japanese Patent JP6427383
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition having excellent adhesiveness to a substrate and showing high photosensitivity when used as a photosensitive resin composition.SOLUTION: The resin composition comprises: (A) 100 parts by mass of at least one resin selected from a group consisting of an alkali-soluble resin and a resin having a polymerizable group in a side chain; and (B) 0.001 to 1 part by mass of an amide compound represented by general formula (1) below. In formula (1), Rand Reach independently represent an alkyl group having 1 to 5 carbon atoms; and Rand Reach independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, and the hydrocarbon group may have an ether bond, or Rand Rmay be bonded to form a ring structure.SELECTED DRAWING: None
Inventors:
Nobuhiro Anzai
Application Number:
JP2014214295A
Publication Date:
November 21, 2018
Filing Date:
October 21, 2014
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08F299/02; C08K5/20; C08L79/08; G03F7/027; G03F7/085; H01L21/027
Domestic Patent References:
| JP2013250429A | ||||
| JP2011191749A | ||||
| JP2003287889A | ||||
| JP2002182378A | ||||
| JP2009163080A | ||||
| JP2002534493A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata
Shunsuke Mima
Toko Saito
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata
Shunsuke Mima
Toko Saito