Title:
半導体チップの製造方法
Document Type and Number:
Japanese Patent JP6444805
Kind Code:
B2
Inventors:
Yusaku Asano
Keiichiro Matsuo
Issei Shimokawa
Kazuhito Higuchi
Hisashi Ito
Keiichiro Matsuo
Issei Shimokawa
Kazuhito Higuchi
Hisashi Ito
Application Number:
JP2015097629A
Publication Date:
December 26, 2018
Filing Date:
May 12, 2015
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/301; H01L21/308
Domestic Patent References:
| JP2001148358A | ||||
| JP2011060846A | ||||
| JP2006295067A | ||||
| JP2004259872A |
Foreign References:
| US8278191 |
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
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