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Title:
ディップ成形用ラテックス状組成物及びそれから製造された成形品
Document Type and Number:
Japanese Patent JP6461337
Kind Code:
B2
Abstract:
Disclosed is a latex composition for dip-molding and a dip-molded article produced therefrom. More specifically, by using a water-soluble polymer such as poly(N-isopropylacrylamide) or a copolymer thereof in combination with a carbonic acid-modified nitrile-based copolymer latex, the stability of the latex is improved through crosslinking by hydrogen bonding, it is possible to manufacture a molded article which has a slow syneresis and is excellent in workability and does not tear even at a thin thickness due to high tensile strength.

Inventors:
Kwon, Won-San
Yoo Sun-Wook
Han, Jeong-su
Yang, Sun-Hun
Application Number:
JP2017523846A
Publication Date:
January 30, 2019
Filing Date:
October 05, 2016
Export Citation:
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Assignee:
LG HAUSYS,LTD.
International Classes:
C08L9/02; A41D19/00; A41D19/04; B29C41/14; C08L33/26
Domestic Patent References:
JP2014530289A
JP2009155634A
JP9025454A
JP10237182A
JP2008138194A
JP3047817A
JP2003021908A
Foreign References:
US20140302265
US20150225553
KR1020150019007A
KR1020020016917A
KR1020140141919A
US20090013446
KR1020080105275A
Other References:
TIMOTHY M. FULGHUM et. al.,Stimuli-Responsive Polymer Ultrathin Films with a Binary Architecture: Combined Layer-by-Layer Polyelectrolyte and Surface-Initiated Polymerization Approach,Macromolecules,米国,American Chemical Society,2008年,第41巻第2号,第429頁-第435頁
Attorney, Agent or Firm:
Patent business corporation Ikeuchi and Partners