Title:
プリント基板への実装を行うための方法およびシステムならびにコンピュータプログラム
Document Type and Number:
Japanese Patent JP6461340
Kind Code:
B2
Abstract:
Populating printed circuit boards with components on a pick-and-place variant set-up is provided. Each set-up includes a number of components, stocks of which are brought to setting-up tables on the pick-and-place line, and a set-up family is associated with each set-up, the family system, a fixed set-up and multiple printed circuit board types which can be populated using the set-up. The fixed set-up is optimized with respect to a weighted parameter, before determining, by means of a simulation, how well variant set-ups, with which the remaining components of predefined pick-and-place orders are associated, can be implemented on the setting-up tables and brought to the pick-and-place line. The quality of each different weighting is determined in order to determine an optimized weighting.
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Inventors:
Alexander pfa finger
Christian royer
Christian royer
Application Number:
JP2017525614A
Publication Date:
January 30, 2019
Filing Date:
October 05, 2015
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
G05B19/418; H05K13/02
Domestic Patent References:
| JP4246897A | ||||
| JP2006171916A | ||||
| JP11177281A | ||||
| JP2012134565A | ||||
| JP2015531160A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima