Title:
光検出装置及び光検出装置の製造方法
Document Type and Number:
Japanese Patent JP6463637
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To keep thickness of a photodetection device to a minimum and improve a signal-to-noise ratio of a detected signal.SOLUTION: A photodetection device comprises a photodetector formed in a substrate and a light emitter formed on the side of a specimen on the upper layer than the photodetector. Light emitted from the light emitter and reflected on the specimen is detected by the photodetector. With this configuration, the light emitter is built in the photodetection device, so that thickness of the photodetection device can be kept to a minimum. Since the light emitter is placed on the upper layer than the photodetector, light emitted from the light emitter is prevented from being reflected on metal wiring or the like and detected by the photodetector as unnecessary reflected light, so that a signal-to-noise ratio of a detected signal can be improved.SELECTED DRAWING: Figure 8
Inventors:
Michiru Senda
Application Number:
JP2015007862A
Publication Date:
February 06, 2019
Filing Date:
January 19, 2015
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
G06T1/00; H01L27/146
Domestic Patent References:
| JP2006065305A | ||||
| JP2012221083A | ||||
| JP2009003821A | ||||
| JP2006301864A |
Foreign References:
| WO2014162388A1 |
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara
Kazuki Matsumoto
Tetsuo Kanamoto
Koji Hagiwara
Kazuki Matsumoto