Title:
回路付サスペンション基板およびその製造方法
Document Type and Number:
Japanese Patent JP6466747
Kind Code:
B2
Abstract:
A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.
Inventors:
Hiroyuki Tanabe
Yu Sugimoto
Hitoshi Fujimura
Yu Sugimoto
Hitoshi Fujimura
Application Number:
JP2015049039A
Publication Date:
February 06, 2019
Filing Date:
March 12, 2015
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G11B5/60; G11B21/21; H05K1/11
Domestic Patent References:
| JP2010108576A | ||||
| JP2012104211A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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