Title:
加工装置
Document Type and Number:
Japanese Patent JP6474275
Kind Code:
B2
Abstract:
The invention provides a machining apparatus which can reliably hold a wrapped wafer. A position detecting mechanism (124) is provided with a guiding part (124c). The guiding part supports the wafer (W) which exceeds the outer periphery of a central working platform (124a) and corrects the wafer (W) in a projected wrapped shape. Furthermore, on condition that the wafer (W) is corrected to horizontal, the outer peripheral edge (WE) of the wafer (W) is detected through a position detecting sensor (124d), and furthermore the central position of the wafer (W) is calculated according to the detected outer peripheral edge (WE) of the wafer (W) for aligning with the central position of a chuck worktable.
Inventors:
Kazuki Terada
Hiranuma Chihiro
Hiranuma Chihiro
Application Number:
JP2015030692A
Publication Date:
February 27, 2019
Filing Date:
February 19, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/68; H01L21/301; H01L21/677
Domestic Patent References:
| JP2002329769A |
Attorney, Agent or Firm:
Hiroaki Sakai