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Title:
パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ
Document Type and Number:
Japanese Patent JP6480428
Kind Code:
B2
Abstract:
A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

Inventors:
Anne M. Gilman
Mikaile El Pekrovsky
Matthew S. Stay
Sean Shee Dodds
Daniel Jay Says
Application Number:
JP2016518723A
Publication Date:
March 13, 2019
Filing Date:
September 22, 2014
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H05K3/28; G02F1/1333; G06F3/041; H05K3/02
Domestic Patent References:
JP2011517367A
JP5388163A
JP5799797A
JP62154793A
JP2007526622A
JP201062525A
JP2016530622A
JP2010507261A
JP2013522814A
JP2015510219A
JP2011508016A
JP423345B1
Foreign References:
US20080158181
WO2012147235A1
US20090129004
US20110232954
US3660088
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi
Hajime Kawahara
Naori Kota
Satoshi Deno