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Title:
アライメント装置、基板貼り合わせ装置、位置合わせ方法、及び、積層半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6489199
Kind Code:
B2
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Inventors:
Kazuya Okamoto
Isao Sugaya
Okada Masashi
Mitsuishi
Application Number:
JP2017249317A
Publication Date:
March 27, 2019
Filing Date:
December 26, 2017
Export Citation:
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Assignee:
NIKON CORPORATION
International Classes:
H01L21/02; H01L21/68
Domestic Patent References:
JP2011216833A
JP5190435A
JP2001203147A
JP63232325A
JP2006310734A
JP2000150361A
Attorney, Agent or Firm:
Longhua International Patent Service Corporation



 
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