Title:
摩擦なく接続された接触要素を有する圧縮性ピンアセンブリ
Document Type and Number:
Japanese Patent JP6489749
Kind Code:
B2
More Like This:
| WO/2024/101475 | POGO PIN AND MANUFACTURING METHOD THEREFOR |
| JP4808794 | Semiconductor inspection equipment |
| JP6118710 | Probe card |
Inventors:
Ka Ga Chui
Application Number:
JP2014059617A
Publication Date:
March 27, 2019
Filing Date:
March 24, 2014
Export Citation:
Assignee:
Corado Technology Incorporated
International Classes:
G01R1/067; G01R1/073; H01R13/24
Domestic Patent References:
| JP2004296301A | ||||
| JP2004333459A | ||||
| JP2000322938A | ||||
| JP11162270A | ||||
| JP2002158052A | ||||
| JP200947565A |
Foreign References:
| US6773312 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro