Title:
部材準備方法および部材準備装置
Document Type and Number:
Japanese Patent JP6496915
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a member preparation method and a member preparation device that can appropriately prepare members used in manufacture of a mounting board.SOLUTION: A member preparation method includes: a requirement rank determination step (ST2) of determining, on the basis of substrate information including mounting positions of members mounted on a mounting board in which the members are mounted on a substrate, and member information on the members mounted on the mounting board, a required member rank of members suitable for manufacture of the mounting board; an adaptable member extraction step (ST3) of extracting, on the basis of a manufacturing plan for the mounting board and held member information in which the member rank is associated with each of a plurality of members that can be used in manufacture of the mounting board, adaptable members adaptable to the required member rank from the plurality of members; a usable member selection step (ST10) of selecting usable members used in manufacture of the mounting board from the adaptable members; and a member preparation instruction step (ST11) of creating instructions for preparing the usable members.SELECTED DRAWING: Figure 18
Inventors:
Atsushi Nakazono
Application Number:
JP2017057069A
Publication Date:
April 10, 2019
Filing Date:
March 23, 2017
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/04
Domestic Patent References:
| JP201398360A | ||||
| JP2009123893A | ||||
| JP201717174A | ||||
| JP2002190700A | ||||
| JP5945690B2 |
Foreign References:
| WO2017037879A1 |
Attorney, Agent or Firm:
Kenji Kamada
Koichi Nomura
Koichi Nomura