Title:
金属物体を通じたワイヤレス電力伝達
Document Type and Number:
Japanese Patent JP6505753
Kind Code:
B2
Abstract:
A method and system for providing wireless power transfer through a metal object is provided. In one aspect, an apparatus for wirelessly receiving power via a magnetic field is provided. The apparatus includes a metal cover including an inner portion and an outer portion. The outer portion is configured to form a loop around the inner portion of the metal cover. The outer portion is configured to inductively couple power via the magnetic field. The apparatus includes a receive circuit electrically coupled to the outer portion and configured to receive a current from the outer portion generated in response to the magnetic field. The receive circuit is configured to charge or power a load based on the current.
Inventors:
Song Hong Jung
May-Lee Chi
Curtis gon
David George Fern
Francesco Caroborante
May-Lee Chi
Curtis gon
David George Fern
Francesco Caroborante
Application Number:
JP2016574396A
Publication Date:
April 24, 2019
Filing Date:
May 29, 2015
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H02J50/60; H02J7/00; H02J50/12
Domestic Patent References:
| JP2012249281A | ||||
| JP2012186811A | ||||
| JP2014079019A | ||||
| JP2013042376A | ||||
| JP2015149833A | ||||
| JP2012502613A | ||||
| JP2009290764A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei