Title:
ドアモジュール及びその使用
Document Type and Number:
Japanese Patent JP6506405
Kind Code:
B2
Abstract:
In an embodiment, the present invention is an enclosure for housing electronic equipment, which includes a frame for mounting the electronic equipment, a gateway connected to the frame and in communication with a management application, a door removably mounted to the frame, the door including a plurality of door-mounted electronic devices, at least one of the door-mounted electronic devices requiring an interface that is different from at least one other of the door-mounted electronic devices, a door module attached to the door, the door module providing a plurality of interfaces wherein each of the plurality of door-mounted electronic devices is connected to one of the plurality of interfaces, and a communication link between the door module and the gateway, at least a portion of the communication link consisting of a single communication cable.
Inventors:
Peter Soberburn Kenyon Farrer
Richard Goviel
Alba Bee Eaton
Yuri Astovato Saturov
Richard Goviel
Alba Bee Eaton
Yuri Astovato Saturov
Application Number:
JP2017545592A
Publication Date:
April 24, 2019
Filing Date:
February 08, 2016
Export Citation:
Assignee:
Pandwit Corporation
International Classes:
G06F1/16; G06F1/18; H05K5/03; H05K7/18
Domestic Patent References:
| JP200358282A |
Foreign References:
| US20110199183 | ||||
| US8917513 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe