Title:
電子部品搬送装置及びテーピング電子部品連の製造方法
Document Type and Number:
Japanese Patent JP6520441
Kind Code:
B2
Inventors:
Kakukata Masaru
Naoto Tanaka
Naoto Tanaka
Application Number:
JP2015121298A
Publication Date:
May 29, 2019
Filing Date:
June 16, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00; B65G47/24; B65G47/252
Domestic Patent References:
| JP2011018698A | ||||
| JP2001192115A | ||||
| JP10004290A | ||||
| JP10284355A | ||||
| JP61075724A | ||||
| JP2013153231A | ||||
| JP5057837U | ||||
| JP2001287826A | ||||
| JP2001097538A |
Foreign References:
| US20050167243 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Kazutoshi Nakayama
Masataka Otani
Kazutoshi Nakayama