Title:
異種素材接合方法
Document Type and Number:
Japanese Patent JP6523617
Kind Code:
B2
Abstract:
A device for adhering different kinds of materials is configured to adhere a metal material and a composite material having an adhering hole. The device includes a frame having first and second free ends that face each other. A laser head is provided at the first free end of the frame and irradiates a laser beam to an adhering point of the metal material. An upper tool moves back and forth at the first free end of the frame and presses the metal material. A lower tool is fixed to the second free end of the frame so as to correspond to the upper tool and supports an adhering point of the composite material. An air suction member is connected to the lower tool to suck air between the lower tool and the adhering hole of the composite material.
Inventors:
Lee Ken rain
Willow pill
Willow pill
Application Number:
JP2014110302A
Publication Date:
June 05, 2019
Filing Date:
May 28, 2014
Export Citation:
Assignee:
HYUNDAI MOTOR COMPANY
International Classes:
B23K26/324; B23K26/21; B23K26/22; B23K37/04; B29C65/16
Domestic Patent References:
| JP2006289437A | ||||
| JP11254169A | ||||
| JP2006512221A |
Foreign References:
| DE102011050832A1 |
Attorney, Agent or Firm:
Kyosei International Patent Office