Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP6526115
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technique advantageous to the improvement of sensitivity in a solid state image sensor having a configuration where a plurality of pixels are assigned to each microlens.SOLUTION: A solid state image sensor including a semiconductor substrate having a first surface and a second surface opposite to each other further includes a pixel array where a plurality of pixel sets are arranged, and a plurality of microlenses arranged so that one microlens is assigned to each pixel set. Each pixel set includes a plurality of pixels, and each pixel includes a photoelectric conversion part and a wiring pattern constituting a part of a circuit in the pixel. The photoelectric conversion part is formed on the semiconductor substrate, the wiring pattern is arranged on the first surface of the semiconductor substrate, and the plurality of microlenses are arranged on the second surface of the semiconductor substrate.SELECTED DRAWING: Figure 3

Inventors:
Masaaki Minowa
Hidekazu Takahashi
Yuichiro Yamashita
Akira Okita
Application Number:
JP2017137336A
Publication Date:
June 05, 2019
Filing Date:
July 13, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Canon Inc
International Classes:
H01L27/146; H04N5/369; H04N5/3745
Domestic Patent References:
JP2011176715A
JP2001250931A
JP2010154493A
JP2006093587A
JP2008270298A
JP2009273119A
Foreign References:
US20110279727
US20100128152
Attorney, Agent or Firm:
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu