Title:
多孔質板状フィラー、断熱膜、及び多孔質板状フィラーの製造方法
Document Type and Number:
Japanese Patent JP6527139
Kind Code:
B2
Abstract:
There are provided a porous plate-shaped filler to form a heat insulation film in which a heat insulation effect improves, a heat insulation film including a porous plate-shaped filler, and a method for producing the porous plate-shaped filler. A porous plate-shaped filler 1 is a plate shape having an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 µm and a porosity of 20 to 90%. Furthermore, the porous plate-shaped filler 1 includes plate-shaped pores 2 having an aspect ratio of 1.5 or more. Consequently, in the porous plate-shaped filler 1, a thermal conductivity is low. The heat insulation film includes the porous plate-shaped filler 1, whereby a heat insulation effect of the heat insulation film can improve.
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Inventors:
Hiroshi Kobayashi
Takahiro Tomita
Oribe Akira
Takahiro Tomita
Oribe Akira
Application Number:
JP2016513770A
Publication Date:
June 05, 2019
Filing Date:
April 13, 2015
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C04B38/06; C08K7/22; C08L101/00; C09D1/00; C09D7/40; C09D7/62; C09D201/00
Domestic Patent References:
| JP2009274895A | ||||
| JP2005263537A |
Foreign References:
| WO2013191263A1 |
Attorney, Agent or Firm:
Ippei Watanabe
Shigeru Koike
Shigeru Koike