Title:
ウエハースケールのテスト・インターフェース・ユニット：高速および高密度の混合信号インターコネクトおよびコンタクタのための低損失および高絶縁性の装置および方法
Document Type and Number:
Japanese Patent JP6535347
Kind Code:
B2
Abstract:
Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates.
Inventors:
Thompson, Rick, Elle.
Bunhill, Kenneth
Borisenko, Anatoly, Oh.
Laurin, Jean-Mark
Bunhill, Kenneth
Borisenko, Anatoly, Oh.
Laurin, Jean-Mark
Application Number:
JP2016565116A
Publication Date:
June 26, 2019
Filing Date:
January 16, 2015
Export Citation:
Assignee:
Nubotronics, ink.
International Classes:
H01L21/66; G01R1/073; G01R31/26; G01R31/28
Domestic Patent References:
| JP2016538718A | ||||
| JP2001356136A | ||||
| JP2004325306A | ||||
| JP2008032533A | ||||
| JP6317624A |
Foreign References:
| WO2015077009A1 |
Attorney, Agent or Firm:
Taro Yaguchi