Title:
熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6543930
Kind Code:
B2
Abstract:
The present invention is contemplated for providing a thermosetting resin composition having all of heat resistance, UV resistance and a high refractive index, and the thermosetting resin composition having high adhesion and improved moisture-absorption reflow resistance, heat cycle resistance and sulfur resistance and being excellent in reliability as an LED sealing agent. The invention relates to the thermosetting resin composition containing (A) to (D):
(A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups;
(B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group;
(C) a linear organopolysiloxane compound having an SiH group only at one terminal; and
(D) a Pt catalyst.
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Inventors:
Akio Tajima
Takashi Matsuo
Takeichi Kawabata
Ryoko Ueno
Tohru Ayama
Takashi Matsuo
Takeichi Kawabata
Ryoko Ueno
Tohru Ayama
Application Number:
JP2014546974A
Publication Date:
July 17, 2019
Filing Date:
November 11, 2013
Export Citation:
Assignee:
JNC Corporation
International Classes:
C08L83/14; C08L83/05; C08L83/07; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2012012556A | ||||
| JP2012219184A | ||||
| JP2010280766A | ||||
| JP2015172146A |
Foreign References:
| WO2013005633A1 | ||||
| WO2011145638A1 | ||||
| WO2011148896A1 |
Attorney, Agent or Firm:
Patent business corporation glory patent office