Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6549466
Kind Code:
B2
Abstract:
A semiconductor device including: a fuse element; and a fuse window that is formed above a region including the fuse element, that includes a pair of first sidewalls extending in a first direction running along a direction that current flows in the fuse element and a pair of second sidewalls extending in a second direction intersecting the first direction, and that is formed with a projection projecting out from a sidewall side toward the inside at an inner wall of at least one out of the first sidewalls or the second sidewalls, the projection having a sidewall side width that is narrower than a projecting side width.
Inventors:
Kenichiro Kusano
Application Number:
JP2015208372A
Publication Date:
July 24, 2019
Filing Date:
October 22, 2015
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/82; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
| JP2005129592A | ||||
| JP529467A | ||||
| JP2006278373A | ||||
| JP2012244180A | ||||
| JP2000216341A | ||||
| JP60053048A | ||||
| JP2005209903A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda