電子部品実装装置、基板の製造方法

Title:

電子部品実装装置、基板の製造方法

Document Type and Number:

Japanese Patent JP6556200

Kind Code:

B2

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Inventors:

Masashi Amano
Mikio Nakajima
Yamakage Yusuke
Kazumi Hoshikawa

Application Number:

JP2017169912A

Publication Date:

August 07, 2019

Filing Date:

September 05, 2017

Export Citation:

Assignee:

Fuji corporation

International Classes:

H05K13/04; H05K13/08

Domestic Patent References:

Attorney, Agent or Firm:

Yuki Kataoka

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