Title:
電子装置およびその製造方法とリペア方法
Document Type and Number:
Japanese Patent JP6558990
Kind Code:
B2
Abstract:
There is provided a repair technique capable of repairing interconnect lines and the like in an electronic device with ease and with reliability and capable of suppressing the increase in the number of manufacturing steps associated with the repair to suppress the increase in manufacturing costs. The electronic device having a multi-layer interconnection structure includes: a foundation layer; a patterned interconnect line provided on the foundation layer; and an insulation film formed on the foundation layer and the interconnect line. The insulation film includes at least one thin film part in which at least part of the insulation film which lies on the interconnect line has a thickness less than that of its surroundings.
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Inventors:
Osamu Aoki
Shigeaki Noumi
Yusuke Murakami
Shigeaki Noumi
Yusuke Murakami
Application Number:
JP2015142652A
Publication Date:
August 14, 2019
Filing Date:
July 17, 2015
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/3205; G02F1/1345; G02F1/1368; G09F9/00; G09F9/30; H01L21/285; H01L21/768; H01L23/12; H01L23/522
Domestic Patent References:
| JP10003088A | ||||
| JP2008060264A | ||||
| JP2001077202A | ||||
| JP2004103960A | ||||
| JP2004266224A | ||||
| JP1140742A | ||||
| JP2000012541A | ||||
| JP2005109223A | ||||
| JP2014022601A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita