Title:
実装構造体およびカメラモジュール
Document Type and Number:
Japanese Patent JP6560096
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting structure and a camera module capable of improving the transmission characteristics of differential signals.SOLUTION: A mounting structure 1 comprises: an image pickup device package 2 for mounting an image pickup device 10; and a flexible wiring board 6 mounting the package 2. In the flexible wiring board 6, a distance L2 between a pair of connecting lines 6e is longer than a distance L1 between a pair of differential signal package connecting pads 6e.SELECTED DRAWING: Figure 4
Inventors:
Yuki Kawabata
Application Number:
JP2015207905A
Publication Date:
August 14, 2019
Filing Date:
October 22, 2015
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H04N5/225; G03B17/02; H01L23/12; H05K1/02
Domestic Patent References:
| JP2011239040A | ||||
| JP2012151365A | ||||
| JP2013179692A |