Title:
被嵌合部材、嵌合部材及び接続構造
Document Type and Number:
Japanese Patent JP6560182
Kind Code:
B2
Inventors:
Toshio Kaku
Application Number:
JP2016224179A
Publication Date:
August 14, 2019
Filing Date:
November 17, 2016
Export Citation:
Assignee:
NEC Platforms, Ltd.
International Classes:
H01R13/648; H01R13/652; H01R13/6581; H01R13/6591; H01R24/60
Domestic Patent References:
| JP2011060613A | ||||
| JP7169532A | ||||
| JP3198301U | ||||
| JP1292765A |
Foreign References:
| US20150380870 | ||||
| CN204243363U |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka