Title:
電力変換装置
Document Type and Number:
Japanese Patent JP6562998
Kind Code:
B2
Abstract:
To suppress reduction in resistance against vibrations, while reducing the number of components, a power conversion device including a power semiconductor module that converts a DC current into an AC current, a plate conductor that transfers the DC current or the AC current, a resin sealing material that seals the plate conductor, and an electric component that is used to control the power semiconductor module has the resin sealing material include a supporting member. The supporting member supports the electric component, and the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.
Inventors:
Yosei Hara
Morio Kuwano
Ishii Asahi
Morio Kuwano
Ishii Asahi
Application Number:
JP2017500576A
Publication Date:
August 21, 2019
Filing Date:
January 29, 2016
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
H02M7/48
Domestic Patent References:
| JP2006194650A | ||||
| JP11203946A |
Foreign References:
| WO2014136354A1 | ||||
| WO2013065849A1 |
Attorney, Agent or Firm:
Kaichi International Patent Office