Title:
レジストパターンのトリミング方法
Document Type and Number:
Japanese Patent JP6568762
Kind Code:
B2
Abstract:
A method of trimming a resist pattern, including forming a positive resist film on a substrate, the positive resist film is exposed and the positive resist film is subjected to an alkali development to form a first resist pattern having an alkali-insoluble region on the surface thereof; applying a resist trimming composition including an acid to the substrate on which the first resist pattern is formed; a heating the first resist pattern coated with the resist trimming composition, and the solubility of the first resist pattern in a developing solution is changed under action of the acid included in the resist trimming composition; and developing the first resist pattern after heating with an organic solvent to remove the alkali-insoluble region of the first resist pattern, the resist trimming composition including the acid and a solvent which does not dissolve the first resist pattern.
Inventors:
Ryota Tsunoda
Ryoji Watanabe
Yoichi Hori
Ryoji Watanabe
Yoichi Hori
Application Number:
JP2015198037A
Publication Date:
August 28, 2019
Filing Date:
October 05, 2015
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/40; C08F212/14; C08F220/10; G03F7/039; G03F7/20; H01L21/027
Domestic Patent References:
| JP2014142634A | ||||
| JP2013156629A | ||||
| JP2013156628A | ||||
| JP2015135491A | ||||
| JP2014141455A | ||||
| JP2011257499A | ||||
| JP2010199495A |
Foreign References:
| US20090311490 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida