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Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6571344
Kind Code:
B2
Abstract:
A confirmation unit (67) of a substrate treatment apparatus is provided with an inspection pipeline (671), a conductivity acquisition portion (672), and a determination portion (673). The inspection pipeline (671) includes a plurality of conductive portions (675) and a plurality of insulating portions (676) respectively extending in a longitudinal direction on an inner peripheral surface and alternately disposed in a circumferential direction. The conductivity acquisition portion (672) acquires a conductivity between two conductive portions (675). The determination portion (673), on the basis of the conductivity acquired by the conductivity acquisition portion (672), determines the presence or absence of treatment fluid (71) in the inspection pipeline (671), or the type of the treatment fluid (71) in the inspection pipeline (671). The confirmation unit (67) can determine the presence or absence of the treatment fluid (71) or the type of the treatment fluid (71) throughout the length of the inspection pipeline (671), which may be relatively long. It is therefore possible to improve the accuracy of confirmation of the presence or absence of the treatment fluid (71) or the type thereof.

Inventors:
Nakai Hitoshi
Application Number:
JP2015030310A
Publication Date:
September 04, 2019
Filing Date:
February 19, 2015
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; G01N27/10
Domestic Patent References:
JP5030767B2
JP3261872A
JP11304565A
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida